AMD Ryzen 7000 ‘Raphael’ CPU Rumors: 5nm Zen 4 Lineup To Be Announced at Computex, X670 Flagship Chipset For AM5 Platform, RDNA 2 iGPUs
The next-generation Zen 4 based Ryzen Desktop CPUs will be codenamed Raphael and will replace the Zen 3 based Ryzen 5000 Desktop CPUs that are codenamed, Vermeer. From the information we presently have, Raphael CPUs will be based on the 5nm Zen 4 core computer architecture & will feature 6nm I/O dies in a chiplet design. AMD has hinted at upping the effect counts of its next-gen mainstream desktop CPUs so we can expect a little find from the stream soap of 16 cores & 32 threads .
AMD Readies Athlon Gold PRO 4150GE APU : An Entry-Level purpose With 4 Cores, 5 Vega Compute Units, 35W & 3.7 GHz Max Boost
– acid 4 in Computex, and seems only suport D5 ( central processing unit can both )
– X670 will have no itx ascribable to besides many features
– Mobile Rembrandt CES, background APU on 22 Q3 hypertext transfer protocol : //t.co/qrDoSaDXgN
— 포시포시 ( @ harukaze5719 ) December 22, 2021
The brand new Zen 4 architecture is rumored to deliver astir to 25 % IPC gain over Zen 3 and hit clock speeds of around 5 GHz. AMD ‘s approaching Ryzen 3D V-Cache chips based on the Zen 3 architecture will be featuring stack chiplets so that design is expected to be carried over to AMD ‘s Zen 4 line of chips besides .
The latest rumors claim that AMD will be announcing the Zen 4 chips at Computex 2022 which means Q2 2022 however the launch would n’t take home until the end of Q3 or early Q4 2022 .
AMD Ryzen ‘Zen 3D’ Desktop CPU Expected Features:
- Minor optimization on TSMC’s 7nm process node
- Up to 64 MB of Stacked cache per CCD (96 MB L3 per CCD)
- Up To 15% Average performance improvement in gaming
- Compatible With AM4 Platforms and existing motherboards
- Same TDP as existing consumer Ryzen CPUs
AMD Ryzen ‘Zen 4’ Desktop CPU Expected Features:
AMD Ryzen chips to power fresh Tesla Model 3 & Model Y documentary systems
- Brand New Zen 4 CPU Cores (IPC / Architectural Improvements)
- Brand New TSMC 5nm process node with 6nm IOD
- Support on AM5 Platform With LGA1718 Socket
- Dual-Channel DDR5 Memory Support
- 28 PCIe Gen 4.0 Lanes (CPU Exclusive)
- 105-120W TDPs (Upper Bound Range ~170W)
As for TDP requirements, the AMD AM5 CPU platform will feature six different segments starting with the flagship 170W CPU classify which is recommended for Liquid coolers ( 280mm or higher ). It looks like this will be an aggressively clocked nick with higher voltages and with CPU overclocking support. This segment is followed by 120W TDP CPUs which are recommended to utilize a high-performance air-cooler. Interestingly, the 45-105W variants are listed as SR1/SR2a/SR4 thermal segments which means they would require standard heatsink solutions when running in a stock shape so not much else is required to keep them cool .
AMD AM5 LGA 1718 Socket TDP Segments (Image Source: TtLexignton):
Kopite7kimi besides adds to the AMD AM5 details that the platform might have two unlike IO dies. now it is not known if these are the platform-specific IO dies ( PCH ) or the Ryzen specific IO dies ( IOD ). In the case of the latter, we know that Raphael is going to feature a chiplet blueprint while the Rembrandt APU is most probably going to end up with a monolithic design. The leaker speculates that Zen3D which will be featured in the next-gen Ryzen mainstream batting order will feature a unlike IOD than the one featured on Raphael which makes smell but that would besides suggest that Zen3D will be launching on the AM5 platform which is n’t confirmed as former rumors have alleged AM4 for Zen3D CPUs .
AMD Ryzen ‘Rapahel’ Zen 4 Desktop CPU Socket & Package Pictures (Image Credits: ExecutableFix):
As the images reveal, the AMD Ryzen Raphael Desktop CPUs will feature a perfect squarely shape ( 45x45mm ) but will house a very chonky integrated hotness spreader or IHS. The especial intelligent behind it being then dense is stranger but it could be to balance out the thermal load across multiple chiplets or some wholly another aim. The sides are alike to the IHS featured on the Intel Core-X course of HEDT CPUs .
As for the chopine itself, the AM5 motherboards will feature the LGA1718 socket which is going to last quite some time. The platform will feature DDR5-5200 memory, 28 PCIe lanes, more NVMe 4.0 & USB 3.2 I/O, and may besides ship with native USB 4.0 digest. There will be at least two 600-series chipsets for AM5 initially, the X670 flagship and B650 mainstream. The X670 chipset motherboards are expected to feature both PCIe Gen 5 and DDR5 memory subscribe but there ‘s some change in design that would n’t allow X670 to fit on more entry-level or ITX offerings. so ITX boards will only be available in B650 flavors .
Update: It looks like the leaker has finally revealed the changes AMD has made with its X670 chipset and that is the function of two B650 dies. It is mentioned that this is not a multi-die purpose. There ‘s the likelihood of two PCHs with their own substrates on X670 motherboards indeed due to circumscribed space, X670 on ITX boards wo n’t be happening .
The Raphael Ryzen Desktop CPUs are besides expected to feature RDNA 2 onboard graphics which means that merely like Intel ‘s mainstream desktop lineup, AMD ‘s mainstream batting order will besides feature iGPU graphics support. In regards to how many GPU cores there will be on the modern chips, Bilibili ‘s Enthusiast Citizen states that it will come with either 1 or 2 calculate units which means we will get improving to 128 cores but Greymon55 states that we can get up to 4 calculate units which means we can besides expect up to 256 cores. This will be lesser than the RDNA 2 CU count featured on the soon-to-be-released Ryzen 6000 APUs ‘Rembrandt ‘ but enough to keep Intel ‘s Iris Xe iGPUs at bay .
— Greymon55 ( @ greymon55 ) December 13, 2021
The Zen 4 based Raphael Ryzen CPUs are n’t expected till deep 2022 so there ‘s still a lot of meter left in the launch. The lineup will compete against Intel ‘s Raptor Lake 13th Gen Desktop CPU lineup.
AMD Mainstream Desktop CPU Generations Comparison:
|AMD CPU Family||Codename||Processor Process||Processors Cores/Threads (Max)||TDPs||Platform||Platform Chipset||Memory Support||PCIe Support||Launch|
|Ryzen 1000||Summit Ridge||14nm (Zen 1)||8/16||95W||AM4||300-Series||DDR4-2677||Gen 3.0||2017|
|Ryzen 2000||Pinnacle Ridge||12nm (Zen +)||8/16||105W||AM4||400-Series||DDR4-2933||Gen 3.0||2018|
|Ryzen 3000||Matisse||7nm (Zen 2)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2019|
|Ryzen 5000||Vermeer||7nm (Zen 3)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2020|
|Ryzen 6000||Warhol?||7nm (Zen 3D)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2022|
|Ryzen 7000||Raphael||5nm (Zen 4)||16/32?||105-170W||AM5||600-Series||DDR5-4800||Gen 5.0||2022|
|Ryzen 8000||Granite Ridge||3nm (Zen 5)?||TBA||TBA||AM5||700-Series?||DDR5-5000?||Gen 5.0||2023|
What are you most excited to see in AMD’s next-generation Zen 4 Ryzen Desktop CPUs?
- Increased Core / Thread Count
- Increased IPC (Single-Core Performance)
- Increased Core Clocks (More Tuning Options / Headroom)
- Increased Cache (Plus Vertical Stacks)
- Better Integrated Graphics (RDNA 2)
- More Performance Per Watt
- More Overclocking Capabilities
- Better Platform Support (Good BIOS at launch)
- Cheaper Prices Than Ryzen 5000
- More Enthusiast Options
- More Entry-Level Options
- New Features / Tech (PBO3/IFC2/etc)